Tsinghua University has obtained a patent for a MEMS gas sensor based on wafer-level packaging and its manufacturing method.

According to news from the financial industry on April 23, 2024, according to an announcement from the State Intellectual Property Office, Tsinghua University has obtained a project titled "MEMS gas sensor based on wafer-level packaging and its manufacturing method". The authorization announcement number is CN114894856B, and the application date is 2022. April.

The patent abstract shows that the present disclosure relates to a MEMS gas sensor based on wafer-level packaging and a manufacturing method thereof. The sensor includes: a dielectric layer covering the first surface of the first substrate; each through-silicon via penetrating the first substrate and the dielectric layer; a first insulating layer covering the second surface of the first substrate and exposing each through-silicon via hole; each electrode is located on the second side of the first substrate and connected to the through silicon hole; the heating electrode of the sensor body is on the dielectric layer and connected to the corresponding through silicon hole, and the second insulating layer at least covers the heating electrode; the test electrode is on Above the second insulating layer, the target area overlaps the heating electrode and is connected to the corresponding through silicon vias and the gas-sensitive material layer covers the target area; the second substrate of the cap layer is provided with a container to accommodate at least part of the sensor body. The groove and the ventilation hole connected with the accommodation groove; the bonding ring of the cap layer fixedly connects the base body and the cap layer. The manufactured sensor has good impact resistance and anti-pollution performance, low cost, good uniformity and high industrial production efficiency.

This article comes from: Financial Industry

Author: Intelligence Agent